Special Offer Arctic Silver 5 3.5G Polysynthetic Silver Thermal Grease CPU Heat Sink Compound

There are lots of great products on the market, The Arctic Silver 5 3.5G Polysynthetic Silver Thermal Grease CPU Heat Sink Compound is one that you should have. The Arctic Silver 5 3.5G Polysynthetic Silver Thermal Grease CPU Heat Sink Compound is a high quality product that everyone can invest on. People who have bought and used this product gave it great reviews and impressive ratings. With its budget-friendly price and stunning features, this is definitely a great buy for people who are looking a high quality product that their budget can afford.

Please read product description and product features before you are sure to decide to purchase this product or click here for more details.


  • Thermal Conductance: >350,000W/m2 °C (0.001 inch layer)
  • Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
  • Extended Temperature Limits: Peak: -50°C to >180°C Long-Term: -50°C to 130°C
  • Performance: 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
  • Coverage Area: A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.

AS5-35G ARCTIC SILVER Arctic Silver 5 3.5g Polysynthetic Silver Thermal Grease CPU Hea



 Arctic Silver 5 3.5G Polysynthetic Silver Thermal Grease CPU Heat Sink Compound

Cheap Price Arctic Silver 5 3.5G Polysynthetic Silver Thermal Grease CPU Heat Sink Compound

With so many deals out there, finding the best one for you can be a confusing. Luckily we have done some research for you and reviewed a number of sites that are a few of the best out there. If you would like to get this product at cheap prices, please follow the link above and get special offers for you.

0 comments:

Post a Comment

.

.